On June 15, 2023, Hunan More Than Moore Advanced Semiconductor Co., Ltd. (referred to as "MTM") officially completed the construction of the Chiplet production line in its Zhuzhou Yunlong District. This is the second advanced packaging production line to be completed after the Zhuzhou High-tech plant system-level packaging production line went into mass production. This not only meets the demand of the domestic and international advanced packaging markets but also expands and strengthens MTM's existing advanced packaging capacity and technology process.

MTM is committed to serving customers, promoting industry development with technology, and striving to become a global leading provider of packaging solutions with multi-physics domain joint design, simulation, process development, and one-stop service. It mainly focuses on high computing power fields such as CPU/GPU/DPU/NPU, automotive electronics fields such as Beidou navigation/pressure sensors/car-mounted cameras, industrial control fields such as MCU/driver chips/data converters, new energy fields such as power modules, biomedical fields such as medical products/gene testing/brain-machine interfaces, and wearable devices fields such as heart rate sensors/temperature sensors/processors. MTM provides high-quality services to the SiP advanced packaging industry, aiming to lead with technology and prioritize quality to enhance customer experience.

As a key construction project of the province and city, the first phase of MTM has completed all investments and built the Yunlong district with a total construction area of more than 77,000 square meters. With the completion of the Chiplet production line, MTM's packaging and processing are more scalable, automated, and intelligent, further enhancing the overall performance and one-stop processing and delivery capabilities of advanced packaging products. It will serve a broader semiconductor market and customer base. The production capacity of 1 million fcBGA products and 300 million fcCSP products per year is expected to achieve an annual output value of 600-800 million CNY.

MTM's Chairman, He Xinwen, stated that the rapid development of artificial intelligence and the enormous demand for computing power will drive further development of the semiconductor industry. China's semiconductor industry is in a period of rapid development, which poses higher requirements for the autonomy and innovation of the relevant industrial chain, supply chain, and ecological chain. Constrained by the dual challenges of technology and development costs, enhancing overall chip performance through advanced packaging technology has become a critical path and a new high point in the technological evolution of the integrated circuit industry. According to Yole's forecast, the high-end packaging market is expected to exceed $16 billion by 2028, with a compound annual growth rate of 40% from 2022 to 2028. MTM will seize the opportunities of the advanced packaging market, adhere to innovation-driven development, increase investment in capital, technology, and talents, speed up the achievement and expansion of Yunlong district, continuously launch high-level products and services, and make greater contributions to the high-quality development of the semiconductor industry in Zhuzhou City and Hunan Province.